MPC821 datasheet(180/242 Pages) NXP

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Hardware Preparation and Installation

MPC860TFADS Daughter Board Design Specification—Rev 0.1

MOTOROLA

PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE

2 - Hardware Preparation and Installation

2•1

INTRODUCTION

This chapter provides unpacking instructions, hardware preparation, and installation instructions for

the MPC860TFADSDB.

2•2

UNPACKING INSTRUCTIONS

NOTE

If the shipping carton is damaged upon receipt, re-

quest carrier’s agent to be present during unpack-

ing and inspection of equipment.

Unpack equipment from shipping carton. Refer to packing list and verify that all items are present.

Save packing material for storing and reshipping of equipment.

CAUTION

AVOID TOUCHING AREAS OF INTEGRATED CIR-

CUITRY; STATIC DISCHARGE CAN DAMAGE CIR-

CUITS.

2•3

HARDWARE PREPARATION

To select the desired configuration and ensure proper operation of the MPC860TFADSDB board,

changes of the jumpers settings may be required before installation. The location of the switches,

LEDs, and connectors is illustrated in FIGURE 2-1 "MPC860TFADSDB Top Side Part Location

diagram" on page 5. The board has been factory tested and is shipped with Dip-Switch settings as

described in the following paragraphs. Parameters can be changed for the following conditions:

•

Clock generator.

•

Power-On Reset Source.

•

MPC Keep Alive Power Source

•

MPC Internal Logic Supply Source

•

LXT970 power up configuration.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

MPC821 데이터시트(PDF) 180 Page - NXP Semiconductors