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TBD 데이터시트(PDF) 30 Page - Freescale Semiconductor, Inc |
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TBD 데이터시트(HTML) 30 Page - Freescale Semiconductor, Inc |
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30 / 80 page ![]() MSC8144E Quad Core Digital Signal Processor Data Sheet, Rev. 6 Electrical Characteristics Freescale Semiconductor 30 Table 9 provides the DDR capacitance when VDDDDR(typ) = 1.8 V. 2.6.1.2 DDR (2.5V) SDRAM DC Electrical Characteristics Table 10 provides the recommended operating conditions for the DDR SDRAM component(s) of the MSC8144E when VDDDDR(typ) = 2.5 V. Table 11 provides the DDR capacitance when VDDDDR (typ) = 2.5 V. Table 12 lists the current draw characteristics for MVREF. Table 9. DDR2 SDRAM Capacitance for VDDDDR(typ) = 1.8 V Parameter/Condition Symbol Min Max Unit Input/output capacitance: DQ, DQS, DQS CIO 68 pF Delta input/output capacitance: DQ, DQS, DQS CDIO —0.5 pF Note: This parameter is sampled. VDDDDR = 1.8 V ± 0.090 V, f = 1 MHz, TA =25°C, VOUT = VDDDDR/2, VOUT (peak-to-peak) = 0.2 V. Table 10. DDR SDRAM DC Electrical Characteristics for VDDDDR (typ) = 2.5 V Parameter/Condition Symbol Min Max Unit I/O supply voltage1 VDDDDR 2.3 2.7 V I/O reference voltage2 MVREF 0.49 × VDDDDR 0.51 × VDDDDR V I/O termination voltage3 VTT MVREF – 0.04 MVREF + 0.04 V Input high voltage VIH MVREF + 0.15 VDDDDR + 0.3 V Input low voltage VIL –0.3 MVREF – 0.15 V Output leakage current4 IOZ –50 50 μA Output high current (VOUT = 1.95 V) IOH –16.2 — mA Output low current (VOUT = 0.35 V) IOL 16.2 — mA Notes: 1. VDDDDR is expected to be within 50 mV of the DRAM VDD at all times. 2. MVREF is expected to be equal to 0.5 × VDDDDR, and to track VDDDDR DC variations as measured at the receiver. Peak-to-peak noise on MVREF may not exceed ±2% of the DC value. 3. VTT is not applied directly to the device. It is the supply to which far end signal termination is made and is expected to be equal to MVREF. This rail should track variations in the DC level of VDDDDR. 4. Output leakage is measured with all outputs are disabled, 0 V ≤ V OUT ≤ V DDDDR. Table 11. DDR SDRAM Capacitance for VDDDDR (typ) = 2.5 V Parameter/Condition Symbol Min Max Unit Input/output capacitance: DQ, DQS CIO 68 pF Delta input/output capacitance: DQ, DQS CDIO —0.5 pF Note: This parameter is sampled. VDDDDR = 2.5 V ± 0.125 V, f = 1 MHz, TA = 25°C, VOUT = VDDDDR/2, VOUT (peak-to-peak) = 0.2 V. Table 12. Current Draw Characteristics for MVREF Parameter / Condition Symbol Min Max Unit Current draw for MVREF IMVREF — 500 μA Note: The voltage regulator for MVREF must be able to supply up to 500 μA current. |
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