MPC5606S datasheet(65/136 Pages) FREESCALE

65 / 136 page

MPC5606S Microcontroller Data Sheet, Rev. 6

Freescale Semiconductor

3.6.2

Designing hardened software to avoid noise problems

EMC characterization and optimization are performed at component level with a typical application environment and simplified

MCU software. It should be noted that good EMC performance is highly dependent on the user application and the software in

particular.

Therefore it is recommended that the user apply EMC software optimization and prequalification tests in relation with the EMC

level requested for his application.

•

Software recommendations

The software flowchart must include the management of runaway conditions such as:

— Corrupted program counter

— Unexpected reset

— Critical data corruption (control registers...)

•

Prequalification trials

Most of the common failures (unexpected reset and program counter corruption) can be

reproduced by manually forcing a low state on the reset pin or the oscillator pins for 1 second.

To complete these trials, ESD stress can be applied directly on the device. When unexpected behavior is detected, the

software can be hardened to prevent unrecoverable errors occurring.

3.6.3

Electromagnetic interference (EMI)

3.6.4

Absolute maximum ratings (electrical sensitivity)

Based on two different tests (ESD and LU) using specific measurement methods, the product is stressed in order to determine

its performance in terms of electrical sensitivity.

3.6.4.1

Electrostatic discharge (ESD)

Electrostatic discharges (a positive then a negative pulse separated by 1 second) are applied to the pins of each sample according

to each pin combination. The sample size depends on the number of supply pins in the device (3 parts*(n+1) supply pin). This

test conforms to the AEC-Q100-002/-003/-011 standard.

Table 18. EMI testing specifications1

1 EMI testing and I/O port waveforms per SAE J1752/3 issued 1995-03.

Symbol

Parameter

Conditions

Value

Unit

Min

Typ Max

—

SR T Scan range

150 kHz – 30 MHz: RBW 9 kHz, step size 5 kHz

30 MHz – 1 GHz: RBW 120 kHz, step size 80 kHz

0.15

—

1000 MHz

—

SR T Operating frequency Crystal frequency 8 MHz

—

MHz

—

SR T VDD12, VDDPLL

operating voltages

—

1.28

—

SR T VDD, VDDA

operating voltages

——

—

SR T Maximum amplitude

No PLL frequency modulation

—

dBµV

±2% PLL frequency modulation

—

SR T Operating

temperature

——

—

°C

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