HCS08 datasheet(313/316 Pages) NXP

313 / 316 page

MC9S08SG8 MCU Series Data Sheet, Rev. 8

Freescale Semiconductor

313

Appendix B



Ordering Information and Mechanical Drawings

B.1

Ordering Information

This section contains ordering information for MC9S08SG8 and MC9S08SG4 devices.

B.1.1

Device Numbering Scheme

Table B-1. Device Numbering System

Device

Number1

1 See Table 1-1 for a complete description of modules included on each device.

Memory

Temp Rated2

2 Apply to the temperature rated devices marked with x only.

Available Packages3

3 See Table B-2 for package information.

FLASH

RAM

Standard

AEC Grade 0

20-Pin

16-Pin

8-Pin

S9S08SG8

8 K

512

20 TSSOP

16 TSSOP

8 NB SOIC

S9S08SG4

4 K

256

S9S08SG8

8 K

512

—

16 TSSOP

—

S9S08SG4

4 K

256

S08

SG 8

Status

- S = Auto Qualified

Main Memory Type

- 9 = Flash-based

Core

SG Family

Memory Size

- 8 Kbytes

- 4 Kbytes

Mask Set Identifier

- Alpha character references



wafer fab.

- Numeric character identifies



mask.

Temperature Option

- C = -40 to 85

C

- V = -40 to 105

C

- M = -40 to 125

C

- W = -40 to 150

C

Package Designator

Two letter descriptor

(refer to Table B-2).

Tape and Reel Suffix (optional)

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