MPC8308CVMADDA datasheet(75/95 Pages) NXP

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MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 4

Freescale Semiconductor

Thermal

22.1

Thermal Characteristics

This table provides the package thermal characteristics for the 473, 19

 19 mm MAPBGA.

22.2

Thermal Management Information

For the following sections, PD = (VDD  IDD) + PI/O, where PI/O is the power dissipation of the I/O drivers.

22.2.1

Estimation of Junction Temperature with Junction-to-Ambient

Thermal Resistance

An estimation of the chip junction temperature, TJ, can be obtained from the equation:

TJ = TA + (RJA  PD)

where:

TJ = junction temperature (C)

TA = ambient temperature for the package (C)

RJA = junction-to-ambient thermal resistance (C/W)

PD = power dissipation in the package (W)

The junction-t-ambient thermal resistance is an industry standard value that provides a quick and easy

estimation of thermal performance. As a general statement, the value obtained on a single layer board is

Table 59. Package Thermal Characteristics for MAPBGA

Characteristic

Board Type

Symbol

Value

Unit

Note

Junction to Ambient Natural Convection

Single layer board (1s)

RJA

°C/W

1, 2

Junction to Ambient Natural Convection

Four layer board (2s2p)

RJA

°C/W

1, 2, 3

Junction to Ambient (@200 ft/min)

Single layer board (1s)

RJMA

°C/W

1, 3

Junction to Ambient (@200 ft/min)

Four layer board (2s2p)

RJMA

°C/W

1, 3

Junction to Board

—

RJB

°C/W

Junction to Case

—

RJC

9°C/W

Junction to Package Top

Natural Convection



2°C/W

Notes:

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.

3. Per JEDEC JESD51-6 with the board horizontal.

4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

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