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LXT971ABC 데이터시트(PDF) 88 Page - Intel Corporation

부품명 LXT971ABC
상세설명  3.3V Dual-Speed Fast Ethernet PHY Transceiver
PDF  90 Pages
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제조업체  INTEL [Intel Corporation]
홈페이지  http://www.intel.com
Logo INTEL - Intel Corporation

LXT971ABC 데이터시트(HTML) 88 Page - Intel Corporation

Back Button LXT971ABC Datasheet HTML 82Page - Intel Corporation LXT971ABC Datasheet HTML 83Page - Intel Corporation LXT971ABC Datasheet HTML 84Page - Intel Corporation LXT971ABC Datasheet HTML 85Page - Intel Corporation LXT971ABC Datasheet HTML 86Page - Intel Corporation LXT971ABC Datasheet HTML 87Page - Intel Corporation LXT971ABC Datasheet HTML 88Page - Intel Corporation LXT971ABC Datasheet HTML 89Page - Intel Corporation LXT971ABC Datasheet HTML 90Page - Intel Corporation  
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LXT971A 3.3V Dual-Speed Fast Ethernet Transceiver
88
Datasheet
Document #: 249414
Revision #: 002
Rev. Date: August 7, 2002
7.0
Package Specifications
Figure 43. PBGA Package Specification
1.26 ± 0.10
0.70 ± 0.025
0.26 ± 0.04
0.28 ± 0.10
3
SEATING PLANE
SIDE VIEW
TOP VIEW
BOTTOM VIEW
OPTION:
PIN A1 IDENTIFIER
1.00 ± 0.10
INK OR LASER MARKING
C
7.00 ± 0.20
B
2.00 REF.
0.20 (4X)
NOTES:
1. All dimensions and tolerances conform to ASME Y 14.5 M - 1994.
2. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
3. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
4. Maximum mold to substrate offset shall be 0.127.
5. The surface finish of the package shall be EDM Charmille #18 - #21.
6. Unless otherwise specified tolerance: Decimal ± 0.05 Angular ±2°.
B
H
G
F
E
D
C
A
87
6
5
43
2
1
2
0.70 REF.
6.30
0.80
0.40 ± 0.15
0.30
0.15
C
C
B
A
64-Ball Plastic Ball Grid Array Package
• Part Number - LXT971ABC Commercial Temperature Range (0ºC to +70ºC)
• Part Number - LXT971ABE Extended Temperature Range (-40ºC to +85ºC)



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