MPC8555CPXAPF datasheet(55/88 Pages) FREESCALE

부품명	MPC8555CPXAPF

상세설명	PowerQUICC??III Integrated Communications Processor Hardware Specifications

PDF	88 Pages

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제조업체	FREESCALE [Freescale Semiconductor, Inc]

홈페이지	http://www.freescale.com

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55 / 88 page

MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specifications, Rev. 4

Freescale Semiconductor

Package and Pin Listings

Figure 39 shows the PCI input AC timing conditions.

Figure 39. PCI Input AC Timing Measurement Conditions

Figure 40 shows the PCI output AC timing conditions.

Figure 40. PCI Output AC Timing Measurement Condition

14 Package and Pin Listings

This section details package parameters, pin assignments, and dimensions.

14.1

Package Parameters for the MPC8555E FC-PBGA

The package parameters are as provided in the following list. The package type is 29 mm

× 29 mm, 783

flip chip plastic ball grid array (FC-PBGA).

Die size

8.7 mm

× 9.3 mm × 0.75 mm

Package outline

29 mm

× 29 mm

Interconnects

783

Pitch

1 mm

Minimum module height 3.07 mm

Maximum module height 3.75 mm

Solder Balls

62 Sn/36 Pb/2 Ag

Ball diameter (typical)

0.5 mm

tPCIVKH

CLK

Input

tPCIXKH

CLK

Output Delay

tPCKHOV

High-Impedance

tPCKHOZ

Output

MPC8555CPXAPF 데이터시트(PDF) 55 Page - Freescale Semiconductor, Inc