MPC8555CPXAPF datasheet(72/88 Pages) FREESCALE

부품명	MPC8555CPXAPF

상세설명	PowerQUICC??III Integrated Communications Processor Hardware Specifications

PDF	88 Pages

Scroll/Zoom	100%

제조업체	FREESCALE [Freescale Semiconductor, Inc]

홈페이지	http://www.freescale.com

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72 / 88 page

MPC8555E PowerQUICC™ III Integrated Communications Processor Hardware Specifications, Rev. 4

Freescale Semiconductor

Thermal

the heat sink should be slowly removed. Heating the heat sink to 40-50•C with an air gun can soften the

interface material and make the removal easier. The use of an adhesive for heat sink attach is not

recommended.

Figure 45. Thermal Performance of Select Thermal Interface Materials

The system board designer can choose between several types of thermal interface. There are several

commercially-available thermal interfaces provided by the following vendors:

Chomerics, Inc.

781-935-4850

77 Dragon Ct.

Woburn, MA 01888-4014

Internet: www.chomerics.com

Dow-Corning Corporation

800-248-2481

Dow-Corning Electronic Materials

2200 W. Salzburg Rd.

Midland, MI 48686-0997

Internet: www.dowcorning.com

Shin-Etsu MicroSi, Inc.

888-642-7674

10028 S. 51st St.

Phoenix, AZ 85044

Internet: www.microsi.com

The Bergquist Company

800-347-4572

18930 West 78th St.

0.5

1.5

1020

4050

6070

Silicone Sheet (0.006 in.)

Bare Joint

Floroether Oil Sheet (0.007 in.)

Graphite/Oil Sheet (0.005 in.)

Synthetic Grease

Contact Pressure (psi)

MPC8555CPXAPF 데이터시트(PDF) 72 Page - Freescale Semiconductor, Inc