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CDCUN1208LP 데이터시트(PDF) 5 Page - Texas Instruments |
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CDCUN1208LP 데이터시트(HTML) 5 Page - Texas Instruments |
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5 / 43 page ![]() CDCUN1208LP www.ti.com SCAS928 – MAY 2012 THERMAL INFORMATION CDCUN1208LP THERMAL METRIC(1) QFN32 UNITS 32 PINS θJA Junction-to-ambient thermal resistance 32.5 θJCtop Junction-to-case (top) thermal resistance 24.2 θJB Junction-to-board thermal resistance 6.6 °C/W ψJT Junction-to-top characterization parameter 0.3 ψJB Junction-to-board characterization parameter 6.6 θJCbot Junction-to-case (bottom) thermal resistance 1.6 SPACER (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. RECOMMENDED OPERATING CONDITIONS TA = –40°C TO 85°C MIN NOM MAX UNIT POWER SUPPLIES(1) VDD DC Power Supply - Core 1.8V Mode 1.7 1.8 1.9 V VDDOx DC Power Supply - Output 1.8V Mode 1.7 1.8 1.9 V VDD DC Power Supply - Core 2.5V Mode 2.375 2.5 2.625 V VDDOx DC Power Supply - Output 2.5V Mode 2.375 2.5 2.625 V VDD DC Power Supply - Core 3.3V Mode 2.97 3.3 3.63 V VDDOx DC Power Supply - Output 3.3V Mode 2.97 3.3 3.63 V TEMPERATURE TA Free- Air Temperature –40 85 °C (1) For proper device operation, the core power supply voltage (pin 5) must be applied either before the application of any output power supply or simultaneously with the application of the output power supplies. The application of an output power supply prior to the application of the core power supply could result in improper device behavior. Table 1. CDCUN1208LP Power Consumption (TA = –40°C to 85°C) DEVICE SETTINGS (See Table 2) (1) MAX CURRENT MAX CURRENT TEST PARAMETER DESCRIPTION VDD= 1.8V VDD = 3.3V UNIT CONFIGURATION MODE OE ERC OTTP INSEL ITTP PD Bit fOUT = fin = 100 MHz fOUT = fin = 100MHz Host Configuration Mode IPD1.8,3.3 L or H L X X X L H Device Power Down 3 4 mA (see Host Configuration Mode) ICORE1.8,3.3 O L X X X L X Figure 19a,b,c Device Outputs Off 26 35 mA HCSL Buffer Current IHCSL1.8,3.3 O H O H L O X Figure 19a 23 23 mA Consumption (2) LVDS Buffer Current ILVDS1.8,3.3 O H O L L O X Figure 19b 9 9 mA Consumption (2) LVCMOS Buffer ILVCMOS1.8,3.3 O H O O L O X Figure 19c Current Consumption 8 11 mA (one side) (2) Device Current IDEV-HCSL1.8,3.3 O H O H L O X Figure 19a Consumption – HCSL 200 200 mA Mode Device Current IDEV-LVDS1.8,3.3 O H O L L O X Figure 19b Consumption – LVDS 80 90 mA Mode Device Current IDEV-LVCMOS1.8,3.3 O H O O L O X Figure 19c Consumption – 130 210 mA LVCMOS Mode (1) H = Input High, L = Input Low; O = Input Open (2) Buffer current consumption values represent the average of the current drawn by VDDO1, VDDO2, VDDO3, and VDDO4 divided by 8 (differential mode) or 16 (single-ended mode). Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Link(s) :CDCUN1208LP |
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