32

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17

10

11

12

13

14

15

16

1

2

3

4

5

6

7

8

UN1208LP

GND

(thermal pad )

OUT1P

OUT1N

VDDO1

OUT2P

OUT2N

OUT3P

OUT3N

VDDO2

OE

ERC

MODE

OUT8N

OUT8P

VDDO4

OUT7N

OUT7P

9

CDCUN1208LP

www.ti.com

SCAS928 – MAY 2012

RHB PACKAGE

(TOP VIEW)

PIN

NAME

DESCRIPTION

NUMBER

GND

Thermal Pad

Power supply ground and thermal relief

Device Power Supply, Provides power to the input section and clock distribution section. Use a power supply

VDD

5

voltage that corresponds to the switching levels of clock input(s) (i.e. 1.8V, 2.5V, or 3.3V).

Device Control Mode Select

OPEN = Device Configured via pins (Pin Mode)

MODE

30

LOW = Device Configured via SPI

INTERFACE section.

Input Divider Pin Control

DIVIDE

1

(HIGH = /4, LOW = /2, OPEN = /1)

Device Output Enable

OE

32

HIGH = Enable, LOW = Disable

Output Edge Rate Control

ERC

31

HIGH = Medium, LOW = Slow, OPEN = Fast

INSEL

2

Input Multiplexer Control

ITTP

8

Input Type Select (HIGH = HCSL, LOW = LVDS, OPEN = LVCMOS)

IN1P

3

Universal Input 1 – Positive Terminal

IN1N

4

Universal Input 1 – Negative Terminal, Ground if using IN1 in single-ended mode

IN2P

6

Universal Input 2 – Positive Terminal

IN2N

7

Universal Input 2 – Negative Terminal, Ground if using IN2 in single-ended mode

OTTP

19

Output Type Select (HIGH = HCSL, LOW = LVDS, OPEN = LVCMOS)

OUT1P

9

Output 1 – Positive Terminal

OUT1N

10

Output 1 – Negative Terminal

VDDO1

11

Output Power Supply – OUT1, OUT2

OUT2P

12

Output 2 – Positive Terminal

(1)

This pin list applies to operation of the device in pin mode. In host mode, certain pins take on an alternate function as outlined in

Table 9.

Copyright © 2012, Texas Instruments Incorporated

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