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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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HCS08 데이터시트(PDF) 285 Page - NXP Semiconductors |
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HCS08 데이터시트(HTML) 285 Page - NXP Semiconductors |
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285 / 316 page  Appendix A Electrical Characteristics MC9S08SG8 MCU Series Data Sheet, Rev. 8 Freescale Semiconductor 285 A.4 Thermal Characteristics This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits, and it is user-determined rather than being controlled by the MCU design. To take PI/O into account in power calculations, determine the difference between actual pin voltage and VSS or VDD and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy loads), the difference between pin voltage and VSS or VDD will be very small. Table A-3. Thermal Characteristics Num C Rating Symbol Value Unit Temp Rated1 1 Electrical characteristics only apply to the temperature rated devices marked with x. Standar d AEC Grade 0 1 — Operating temperature range (packaged) TL to TH C C TA –40 to 85 x V–40 to 105 x M–40 to 125 x W–40 to 150 x 2 D Maximum junction temperature C CTJ 95 x V115 x M135 x W155 x D Thermal resistance 2,3 Single-layer board 2 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 3 Junction to Ambient Natural Convection JA Airflow at 200 ft/min Natural Convection 3 8-pin NB SOIC 131 153 C/W x 16-pin TSSOP 115 135 x x 20-pin TSSOP 95 115 x 4 D Thermal resistance2,3 Four-layer board JA Airflow at 200 ft/min Natural Convection 8-pin NB SOIC 95 102 C/W x 16-pin TSSOP 86 94 x x 20-pin TSSOP 69 76 x |
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