HCS08 datasheet(191/198 Pages) NXP

191 / 198 page

MC9S08QD4 Series MCU Data Sheet, Rev. 6

Freescale Semiconductor

191

Appendix B

Ordering Information and Mechanical Drawings

B.1

Ordering Information

This section contains ordering numbers for the devices.

B.1.1

Device Numbering Scheme

•

Numbering Scheme for Consumer and Industrial Products

Figure 12-7. Numbering Scheme for Consumer and Industrial Products

•

Numbering Scheme for Automotive Products

Figure B-1. Numbering Scheme for Automotive Products

Table B-1. Device Numbering System

Device Number1

1 See Table 1-2 for a complete description of modules included on each device.

Memory

Available Packages

Qualification

Flash

RAM

Type

MC9S08QD4

MC9S08QD2

4 KB

2 KB

256 B

128 B

8 PDIP

8 NB SOIC

Consumer and Industrial

S9S08QD4

S9S08QD2

4 KB

2 KB

256 B

128 B

8 NB SOIC

Automotive

Temperature range

Family

Memory

Status

Core

(V = –40

°C to +105°C)

(9 = Flash-based)

9S08 QD

(MC = Fully Qualified)

Package designator (see Table B-2)

Approximate memory size (in Kbytes)

(C = –40

°C to +85°C)

(M = –40

°C to +125°C)

Temperature range

Family

Memory

Status

Core

(V = –40

°C to +105°C)

(9 = Flash-based)

9S08 QD

(S = Fully Qualified)

Package designator (see Table B-2)

Approximate memory size (in Kbytes)

(C = –40

°C to +85°C)

(M = –40

°C to +125°C)

Fab and Maskset Indicator Suffix

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