XPC8260ZUIFBC datasheet(46/50 Pages) FREESCALE

부품명	XPC8260ZUIFBC

상세설명	PowerQUICC II Integrated Communications Processor Hardware Specifications

PDF	50 Pages

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제조업체	FREESCALE [Freescale Semiconductor, Inc]

홈페이지	http://www.freescale.com

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46 / 50 page

MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0

Freescale Semiconductor

Package Description

The following sections provide the package parameters and mechanical dimensions for the MPC826xA.

5.1

Package Parameters

Package parameters are provided in Table 22. The package type is a 37.5

× 37.5 mm, 480-lead TBGA.

3 On PCI devices (MPC8265 and MPC8266) this pin should be used as CLKIN2. On non-PCI devices (MPC8260A and

MPC8264) this is a spare pin that must be pulled down or left floating.

4 Must be pulled down or left floating.

5 On PCI devices (MPC8265 and MPC8266) this pin should be asserted if the PCI function is desired or pulled up or

left floating if PCI is not desired. On non-PCI devices (MPC8260A and MPC8264) this is a spare pin that must be pulled

up or left floating.

6 For information on how to use this pin, refer to MPC8260 PowerQUICC II Thermal Resistor Guide available at

www.freescale.com.

Table 22. Package Parameters

Parameter

Value

Package Outline

37.5

× 37.5 mm

Interconnects

480 (29

× 29 ball array)

Pitch

1.27 mm

Nominal unmounted package height 1.55 mm

XPC8260ZUIFBC 데이터시트(PDF) 46 Page - Freescale Semiconductor, Inc