XPC8260ZUIFBC datasheet(12/50 Pages) FREESCALE

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MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0

Freescale Semiconductor

Electrical and Thermal Characteristics

2.2

Thermal Characteristics

Table 4 describes thermal characteristics.

2.3

Power Considerations

The average chip-junction temperature, TJ, in °C can be obtained from the following:

TJ = TA + (PD x θJA)

(1)

where

TA = ambient temperature °C

JA = package thermal resistance, junction to ambient, °C/W

PD = PINT + PI/O

PINT = IDD x VDD Watts (chip internal power)

PI/O = power dissipation on input and output pins (determined by user)

For most applications PI/O < 0.3 x PINT. If PI/O is neglected, an approximate relationship between PD and

TJ is the following:

PD = K/(TJ + 273° C)

(2)

Solving equations (1) and (2) for K gives:

K = PD x (TA + 273° C) + θJA x PD

(3)

2 The leakage current is measured for nominal VDD, VCCSYN, and VDD.

3 MPC8265 and MPC8266 only.

Table 4. Thermal Characteristics for 480 TBGA Package

Characteristics

Symbol

Value

Unit

Air Flow

Junction to ambient

θJA

131

1 Assumes a single layer board with no thermal vias

°C/W

NC2

2 Natural convection

101

1 m/s

113

3 Assumes a four layer board

1 m/s

Junction to board4

4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is

measured on the top surface of the board near the package.

θJB

°C/W

—

Junction to case5

5 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL

SPEC-883 Method 1012.1).

θJC

1.1

°C/W

—

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