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XPC8260ZUIFBC 데이터시트(PDF) 47 Page - Freescale Semiconductor, Inc |
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XPC8260ZUIFBC 데이터시트(HTML) 47 Page - Freescale Semiconductor, Inc |
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47 / 50 page ![]() MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 2.0 Freescale Semiconductor 47 Package Description 5.2 Mechanical Dimensions Figure 15 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA package. Figure 15. Mechanical Dimensions and Bottom Surface Nomenclature Dim Millimeters Min Max A 1.45 1.65 A1 0.60 0.70 A2 0.85 0.95 A3 0.25 — b 0.65 0.85 D 37.50 BSC D1 35.56 REF e 1.27 BSC E 37.50 BSC E1 35.56 REF Notes: 1. Dimensions and Tolerancing per ASME Y14.5M-1994. 2. Dimensions in millimeters. 3. Dimension b is measured at the maximum solder ball diameter, parallel to primary data A. |
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