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VL53L3CX 데이터시트(PDF) 25 Page - STMicroelectronics |
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VL53L3CX 데이터시트(HTML) 25 Page - STMicroelectronics |
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25 / 35 page ![]() 8 Packaging and labeling 8.1 Product marking A two-line product marking is applied on the backside of the module (i.e. on the substrate). The first line is the silicon product code, and the second line, the internal tracking code (see figure below). Figure 21. Example of prototype marking 8.2 Inner box labeling The labeling follows the ST standard packing acceptance specification. The following information is written on the inner box label: • Assembly site • Sales type • Quantity • Trace code • Marking • Bulk ID number 8.3 Packing At customer/subcontractor level, it is recommended to mount the device in a clean environment to avoid foreign material deposition. To help avoid any foreign material contamination at phone assembly level the modules will be shipped in a tape and reel format, starting from production version (cut1.1). The tape is described in the Figure 22. Tape outline drawing. The packaging will be vacuum-sealed and include a desiccant. VL53L3CX Packaging and labeling DS13204 - Rev 2 page 25/35 |
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