AFE4490 datasheet(2/69 Pages) TI

2 / 69 page

AFE4400

SBAS601D – DECEMBER 2012 – REVISED MAY 2013

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

FAMILY AND ORDERING INFORMATION

LED DRIVE

OPERATING

LED DRIVE

CURRENT

POWER SUPPLY

TEMPERATURE

PRODUCT

PACKAGE-LEAD

CONFIGURATION

(mA, max)

(V)

RANGE

AFE4400

QFN-40

Bridge, push-pull

3 to 3.6

0°C to +70°C

50, 75, 100,

AFE4490

QFN-40

Bridge, push-pull

3 to 5.25

–40°C to +85°C

150, and 200

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

VALUE

UNIT

AVDD to AVSS

–0.3 to +7

DVDD to DGND

–0.3 to +7

AGND to DGND

–0.3 to +0.3

Analog input to AVSS

AVSS – 0.3 to AVDD + 0.3

Digital input to DVDD

DVSS – 0.3 to DVDD + 0.3

Input current to any pin except supply pins(2)

±7

Momentary

±50

Input current

Continuous

±7

Operating temperature range

0 to +70

°C

Storage temperature range, Tstg

–60 to +150

°C

Maximum junction temperature, TJ

+125

°C

Human body model (HBM)

±4000

JEDEC standard 22, test method A114-C.01, all pins

Electrostatic discharge

(ESD) ratings

Charged device model (CDM)

±1500

JEDEC standard 22, test method C101, all pins

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing beyond the supply rails must be current-limited

to 10 mA or less.

THERMAL INFORMATION

AFE4400

THERMAL METRIC(1)

RHA (QFN)

UNITS

40 PINS

θJA

Junction-to-ambient thermal resistance

θJCtop

Junction-to-case (top) thermal resistance

θJB

Junction-to-board thermal resistance

°C/W

ψJT

Junction-to-top characterization parameter

0.1

ψJB

Junction-to-board characterization parameter

n/a

θJCbot

Junction-to-case (bottom) thermal resistance

n/a

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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