1. General Overview:

️· This document details the electrical and power characteristics of the MPC8309 processor.
️· It specifies operating conditions, input/output requirements, and power consumption.

2. Power Supply Voltage Specifications:

️· Core Supply Voltage (VDD): 1.0 V ± 50 mV
️· PLL Supply Voltage (AVDD1, AVDD2, AVDD3): 1.0 V ± 50 mV
️· DDR2 I/O Voltage (GVDD): 1.8 V ± 100 mV
️· I/O Voltage (OVDD): 3.3 V ± 300 mV (Specifically, refers to NVDDA, NVDDB, NVDDC, NVDDF, NVDDG, and NVDDH from the ball map)
️· Junction Temperature: 0 to 105 °C
️· Power Sequencing: Core Voltage (Vdd) should be applied before I/O voltages (Gvdd, Ovdd), and PORESET asserted before full power-up.
️· Input Capacitance: For most pins: 6-8 pF. For SYS_CLK_IN and QE_CLK_IN: 10 pF (external clock generator must be able to drive 10pF).

3. Output Driver Characteristics:

️· Local Bus: 42 Ω impedance at 3.3V
️· PCI: 25 Ω impedance at 3.3V
️· DDR2: 18 Ω impedance at 1.8V
️· DUART, System Control, I2C, SPI, JTAG, GPIO: 42 Ω impedance at 3.3V

4. Power Characteristics (Typical & Maximum):

️· These values are for the processor core, excluding I/O power.
️· Typical Power Consumption (depends on frequency):
- 266 MHz Core: 0.341 - 0.920 W
- 333 MHz Core: 0.361 - 0.938 W
- 400 MHz Core: 0.381 - 0.969 W
- 417 MHz Core: 0.429 - 1.003 W
️· Factors Affecting Power: Voltage, ambient temperature, and the running application.

Important Notes & Cautions (from the document):

️· Power Sequencing: Be mindful of the power-up sequencing requirements to avoid contention and excessive current.
️· Input Voltage Limits: Input voltages must not exceed specified limits (+/- 0.3V relative to supply voltages) for extended periods.
️· Power Down: No specific power-down sequence is required.



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