DSP56366P datasheet(28/110 Pages) NXP

28 / 110 page

DSP56366 Technical Data, Rev. 3.1

3-2

Freescale Semiconductor

3.3

Thermal Characteristics

Operating temperature range

−40 to +110

°C

Storage temperature

TSTG

−55 to +125

°C

1 GND = 0 V, V

CC = 3.3 V ± 0.16 V, TJ = –40°C to +110°C, CL = 50 pF

2 Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond

the maximum rating may affect device reliability or cause permanent damage to the device.

3 CAUTION: All “5 V Tolerant” input voltages must not be more than 3.95 V greater than the supply voltage; this restriction

applies to “power on”, as well as during normal operation. In any case, the input voltages cannot be more than 5.75 V. “5 V

Tolerant” inputs are inputs that tolerate 5 V.

Table 3-2 Thermal Characteristics

Characteristic

Symbol

LQFP Value

Unit

Junction-to-ambient thermal resistance1, 2 Natural Convection

1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site

(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board

thermal resistance.

2 Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.

RθJA or θJA

°C/W

Junction-to-case thermal resistance3

3 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1).

RθJC or θJC

°C/W

Thermal characterization parameter4 Natural Convection

4 Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is

written as Psi-JT.

2.0

°C/W

Table 3-1 Maximum Ratings (continued)

Rating1

Symbol

Value1, 2

Unit

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