CC1110-RTR1 datasheet(29/203 Pages) TI

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CC1110

CC1110 PRELIMINARY Datasheet (Rev. 1.01) SWRS033A

Page 29 of 202

11 Application Circuit

This section describes the recommended

application circuit for the RF part of the

CC1110,

together with crystal oscillator connections.

Only a few external components are required

for using the

CC1110. RF transceiver. The

recommended application circuit is shown in

Figure 6. The external components are

described in Table 23, and typical values are

given in Table 24.

11.1 Bias resistor

The bias resistor R271 is used to set an

accurate bias current. It is very important to

use the specified tolerance for this resistor.

11.2 Balun and RF matching

C231, C241, L231 and L241 form the

recommended

balun

that

converts

the

differential RF port on

CC1110 to a single-ended

RF signal (C234 is also needed for DC

blocking). Together with an appropriate LC

network, the balun components also transform

the impedance to match a 50

Ω antenna (or

cable). Component values for the RF balun

and LC network are easily found using the

SmartRF® Studio software. Suggested values

are listed in Table 24.

11.3 Crystal

The crystal oscillator uses an external crystal

X1, with two loading capacitors (C201 and

C211). See section 14 on page 153 for details.

The circuit also shows the connections for the

optional 32.768 kHz crystal oscillator, with

external crystal X2 and loading capacitors

C181 and C171. This crystal oscillator is used

by the Sleep Timer providing a real-time clock

function and is not required for radio operation.

11.4 Power supply decoupling

The power supply must be properly decoupled

close to the supply pins. Note that decoupling

capacitors are not shown in the application

circuit. The placement and the size of the

decoupling capacitors are very important to

achieve the optimum performance. Chipcon

provides a reference design that should be

followed closely.

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