Figure 36. Solder profile

Note:

The component should be limited to a maximum of three passes through this solder profile.

Note:

As the VL53L8CH package is not sealed, only a dry reflow process should be used (such as convection reflow).

Vapor phase reflow is not suitable for this type of optical component.

Note:

The VL53L8CH is an optical component and as such, it should be treated carefully. This typically includes using

a ‘no-wash’ assembly process.

11.6

Handling and storage precautions

11.6.1

Recommended solder pad dimensions

Figure 37. Recommended solder pattern

VL53L8CH

Handling and storage precautions

DS14310 - Rev 3

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