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PIFE32251B-R47MS 데이터시트(PDF) 83 Page - Texas Instruments

부품명 PIFE32251B-R47MS
상세설명  PMIC for Intel Apollo Lake Platform
PDF  96 Pages
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제조업체  TI1 [Texas Instruments]
홈페이지  http://www.ti.com
Logo TI1 - Texas Instruments

PIFE32251B-R47MS 데이터시트(HTML) 83 Page - Texas Instruments

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BUCK2
BUCK3
BUCK5
BUCK4
BUCK1
BUCK6
VTT
VREF Capacitor
83
TPS65094
www.ti.com
SWCS133C – SEPTEMBER 2015 – REVISED FEBRUARY 2019
Submit Documentation Feedback
Product Folder Links: TPS65094
Layout
Copyright © 2015–2019, Texas Instruments Incorporated
9
Layout
9.1
Layout Guidelines
For a detailed description regarding layout recommendations, refer to the TPS65094x Design Guide and
to the TPS65094x Schematic Checklist, Layout Checklist, and ILIM Calculator Tool. For all switching
power supplies, the layout is an important step in the design, especially at high peak currents and high
switching frequencies. If the layout is not carefully done, the regulator can have stability problems and EMI
issues. Therefore, use wide and short traces for the main current path and for the power ground tracks.
The input capacitors, output capacitors, and inductors must be placed as close as possible to the device.
Use a common-ground node for power ground and use a different, isolated node for control ground to
minimize the effects of ground noise. Connect these ground nodes close to the AGND pin by one or two
vias. Use of the design guide is highly encouraged in addition to the following list of other basic
requirements:
Do not allow the AGND, PGNDSNSx, or FBGND2 to connect to the thermal pad on the top layer.
To ensure proper sensing based on FET RDSON, PGNDSNSx must not connect to PGND until very
close to the PGND pin of the FET.
All inductors, input/output capacitors, and FETs for the converters and controller must be on the same
board layer as the device.
To achieve the best regulation performance, place feedback connection points near the output
capacitors and minimize the control feedback loop as much as possible.
Bootstrap capacitors must be placed close to the device.
The input and output capacitors of the internal reference regulators must be placed close to the device
pins.
Route DRVHx and SWx as a differential pair. Ensure that there is a PGND path routed in parallel with
DRVLx, which provides optimal driver loops.
9.2
Layout Example
Figure 9-1. EVM Layout Example With All Components on the Top Layer



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