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PIFE32251B-R47MS 데이터시트(PDF) 89 Page - Texas Instruments

부품명 PIFE32251B-R47MS
상세설명  PMIC for Intel Apollo Lake Platform
PDF  96 Pages
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제조업체  TI1 [Texas Instruments]
홈페이지  http://www.ti.com
Logo TI1 - Texas Instruments

PIFE32251B-R47MS 데이터시트(HTML) 89 Page - Texas Instruments

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PACKAGE OPTION ADDENDUM
www.ti.com
8-Mar-2019
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking
(4/5)
Samples
TPS650940A0RSKR
ACTIVE
VQFN
RSK
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
T650940A0
PG1.0
TPS650940A0RSKT
ACTIVE
VQFN
RSK
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
T650940A0
PG1.0
TPS650941A0RSKR
ACTIVE
VQFN
RSK
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
T650941A0
PG1.0
TPS650941A0RSKT
ACTIVE
VQFN
RSK
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
T650941A0
PG1.0
TPS650942A0RSKR
ACTIVE
VQFN
RSK
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
T650942A0
PG1.0
TPS650942A0RSKT
ACTIVE
VQFN
RSK
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
T650942A0
PG1.0
TPS650944A0RSKR
ACTIVE
VQFN
RSK
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
T650944A0
PG1.0
TPS650944A0RSKT
ACTIVE
VQFN
RSK
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
T650944A0
PG1.0
TPS650945A0RSKR
ACTIVE
VQFN
RSK
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
T650945A0
PG1.0
TPS650945A0RSKT
ACTIVE
VQFN
RSK
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
T650945A0
PG1.0
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.



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