DSP56362AD datasheet(12/168 Pages) MOTOROLA

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1-4

DSP56362 Advance Information

MOTOROLA

Signal/Connection Descriptions

Ground

GROUND

Table 1-3 Grounds

Ground

Name

Description

GNDP

PLL Ground—GNDP is a ground dedicated for PLL use. The connection should be

provided with an extremely low-impedance path to ground. VCCP should be

bypassed to GNDP by a 0.47 µF capacitor located as close as possible to the chip

package. There is one GNDP connection.

GNDP1

PLL Ground 1—GNDP1 is a ground dedicated for PLL use. The connection should

be provided with an extremely low-impedance path to ground. There is one GNDP1

connection.

GNDQ (4)

Quiet Ground—GNDQ is an isolated ground for the internal processing logic. This

connection must be tied externally to all other chip ground connections. The user

must provide adequate external decoupling capacitors. There are four GNDQ

connections.

GNDA (4)

Address Bus Ground—GNDA is an isolated ground for sections of the address

bus I/O drivers. This connection must be tied externally to all other chip ground

connections. The user must provide adequate external decoupling capacitors.

There are four GNDA connections.

GNDD (4)

Data Bus Ground—GNDD is an isolated ground for sections of the data bus I/O

drivers. This connection must be tied externally to all other chip ground

connections. The user must provide adequate external decoupling capacitors.

There are four GNDD connections.

GNDC (2)

Bus Control Ground—GNDC is an isolated ground for the bus control I/O drivers.

This connection must be tied externally to all other chip ground connections. The

user must provide adequate external decoupling capacitors. There are two GNDC

connections.

GNDH

Host Ground—GNDH is an isolated ground for the HDI08 I/O drivers. This

connection must be tied externally to all other chip ground connections. The user

must provide adequate external decoupling capacitors. There is one GNDH

connection.

GNDS (2)

SHI, ESAI, DAX, and Timer Ground—GNDS is an isolated ground for the SHI,

ESAI, DAX, and Timer I/O drivers. This connection must be tied externally to all

other chip ground connections. The user must provide adequate external

decoupling capacitors. There are two GNDS connections.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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