DSP56367 datasheet(26/100 Pages) FREESCALE

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Thermal Characteristics

DSP56367 Technical Data, Rev. 2.1

3-2

Freescale Semiconductor

3.3

Thermal Characteristics

Table 3-1 Maximum Ratings

Rating1

Symbol

Value1, 2

1 GND = 0 V, VCCP, VCCQL = 1.8 V ±5%, TJ = –40×C to +95×C, CL = 50 pF

All other VCC = 3.3 V ± 5%, TJ = –40×C to +95×C, CL = 50 pF

2 Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond

the maximum rating may affect device reliability or cause permanent damage to the device.

Unit

Supply Voltage

VCCQL, VCCP

−0.3 to + 2.0

VCCQH, VCCA, VCCD,

VCCC, VCCH, VCCS,

−0.3 to + 4.0

All “3.3V tolerant” input voltages

VIN

GND

− 0.3 to V

CC + 0.7

Current drain per pin excluding VCC and GND

Operating temperature range3

3 Temperatures below -0°C are qualified for consumer applications.

−40 to + 95

°C

Storage temperature

TSTG

−55 to +125

°C

Table 3-2 Thermal Characteristics

Characteristic

Symbol

TQFP Value

Unit

Natural Convection, Junction-to-ambient thermal resistance1,2

1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site

(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board

thermal resistance.

2 Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.

RθJA or θJA

45.0

°C/W

Junction-to-case thermal resistance3

3 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1).

RθJC or θJC

10.0

°C/W

Natural Convection, Thermal characterization parameter4

4 Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is

written as Psi-JT.

ΨJT

3.0

°C/W

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