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MPC8321EVRADDC 데이터시트(PDF) 21 Page - Freescale Semiconductor, Inc |
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MPC8321EVRADDC 데이터시트(HTML) 21 Page - Freescale Semiconductor, Inc |
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21 / 82 page ![]() MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 21 Ethernet and MII Management Figure 7 shows the MII transmit AC timing diagram. Figure 7. MII Transmit AC Timing Diagram 8.2.1.2 MII Receive AC Timing Specifications Table 24 provides the MII receive AC timing specifications. TX_CLK data clock fall time tMTXF 1.0 — 4.0 ns Note: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX symbolizes MII transmit timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in general, the clock reference symbol representation is based on two to three letters representing the clock of a particular functional. For example, the subscript of tMTX represents the MII(M) transmit (TX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). Table 24. MII Receive AC Timing Specifications At recommended operating conditions with OVDD of 3.3 V ± 10%. Parameter/Condition Symbol1 Min Typical Max Unit RX_CLK clock period 10 Mbps tMRX —400 — ns RX_CLK clock period 100 Mbps tMRX —40 — ns RX_CLK duty cycle tMRXH/tMRX 35 — 65 % RXD[3:0], RX_DV, RX_ER setup time to RX_CLK tMRDVKH 10.0 — — ns RXD[3:0], RX_DV, RX_ER hold time to RX_CLK tMRDXKH 10.0 — — ns RX_CLK clock rise time tMRXR 1.0 — 4.0 ns Table 23. MII Transmit AC Timing Specifications (continued) At recommended operating conditions with OVDD of 3.3 V ± 10%. Parameter/Condition Symbol1 Min Typical Max Unit TX_CLK TXD[3:0] tMTKHDX tMTX tMTXH tMTXR tMTXF TX_EN TX_ER |
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