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MPC8321EVRADDC 데이터시트(PDF) 71 Page - Freescale Semiconductor, Inc |
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MPC8321EVRADDC 데이터시트(HTML) 71 Page - Freescale Semiconductor, Inc |
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71 / 82 page ![]() MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4 Freescale Semiconductor 71 Thermal 22.7 Suggested PLL Configurations To simplify the PLL configurations, the MPC8323E might be separated into two clock domains. The first domain contain the CSB PLL and the core PLL. The core PLL is connected serially to the CSB PLL, and has the csb_clk as its input clock. The second clock domain has the QUICC Engine PLL. The clock domains are independent, and each of their PLLs are configured separately. Both of the domains has one common input clock. Table 63 shows suggested PLL configurations for 33, 25, and 66 MHz input clocks. 23 Thermal This section describes the thermal specifications of the MPC8323E. 23.1 Thermal Characteristics Table 64 provides the package thermal characteristics for the 516 27 × 27 mm PBGA of the MPC8323E. Table 63. Suggested PLL Configurations Conf No. SPMF Core PLL CEMF CEDF Input Clock Frequency (MHz) CSB Frequency (MHz) Core Frequency (MHz) QUICC Engine Frequency (MHz) 1 0100 0000100 0110 0 33.33 133.33 266.66 200 2 0100 0000101 1000 0 25 100 250 200 3 0010 0000100 0011 0 66.67 133.33 266.66 200 4 0100 0000101 0110 0 33.33 133.33 333.33 200 5 0101 0000101 1000 0 25 125 312.5 200 6 0010 0000101 0011 0 66.67 133.33 333.33 200 Table 64. Package Thermal Characteristics for PBGA Characteristic Board type Symbol Value Unit Notes Junction-to-ambient natural convection Single-layer board (1s) RθJA 28 °C/W 1, 2 Junction-to-ambient natural convection Four-layer board (2s2p) RθJA 21 °C/W 1, 2, 3 Junction-to-ambient (@200 ft/min) Single-layer board (1s) RθJMA 23 °C/W 1, 3 Junction-to-ambient (@200 ft/min) Four-layer board (2s2p) RθJMA 18 °C/W 1, 3 Junction-to-board — RθJB 13 °C/W 4 Junction-to-case — RθJC 9°C/W 5 |
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