MPC8321EVRADDC datasheet(75/82 Pages) FREESCALE

75 / 82 page

MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4

Freescale Semiconductor

Thermal

Wakefield Engineering

603-635-5102

33 Bridge St.

Pelham, NH 03076

Internet: www.wakefield.com

Interface material vendors include the following:

Chomerics, Inc.

781-935-4850

77 Dragon Ct.

Woburn, MA 01801

Internet: www.chomerics.com

Dow-Corning Corporation

800-248-2481

Dow-Corning Electronic Materials

P.O. Box 994

Midland, MI 48686-0997

Internet: www.dowcorning.com

Shin-Etsu MicroSi, Inc.

888-642-7674

10028 S. 51st St.

Phoenix, AZ 85044

Internet: www.microsi.com

The Bergquist Company

800-347-4572

18930 West 78th St.

Chanhassen, MN 55317

Internet: www.bergquistcompany.com

23.3

Heat Sink Attachment

When attaching heat sinks to these devices, an interface material is required. The best method is to use

thermal grease and a spring clip. The spring clip should connect to the printed-circuit board, either to the

board itself, to hooks soldered to the board, or to a plastic stiffener. Avoid attachment forces which would

lift the edge of the package or peel the package from the board. Such peeling forces reduce the solder joint

lifetime of the package. Recommended maximum force on the top of the package is 10 lb (4.5 kg) force.

If an adhesive attachment is planned, the adhesive should be intended for attachment to painted or plastic

surfaces and its performance verified under the application requirements.

23.3.1

Experimental Determination of the Junction Temperature with a

Heat Sink

When heat sink is used, the junction temperature is determined from a thermocouple inserted at the

interface between the case of the package and the interface material. A clearance slot or hole is normally

required in the heat sink. Minimizing the size of the clearance is important to minimize the change in

thermal performance caused by removing part of the thermal interface to the heat sink. Because of the

experimental difficulties with this technique, many engineers measure the heat sink temperature and then

back calculate the case temperature using a separate measurement of the thermal resistance of the

MPC8321EVRADDC 데이터시트(PDF) 75 Page - Freescale Semiconductor, Inc

MPC8321EVRADDC 데이터시트(HTML) 75 Page - Freescale Semiconductor, Inc

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82

데이터시트 다운로드

링크 URL