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PIFE32251B-R68MS 데이터시트(PDF) 148 Page - Texas Instruments

부품명 PIFE32251B-R68MS
상세설명  Simple and Flexible Wide Input Voltage PMU for Mobile Computers
PDF  157 Pages
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제조업체  TI1 [Texas Instruments]
홈페이지  http://www.ti.com
Logo TI1 - Texas Instruments

PIFE32251B-R68MS 데이터시트(HTML) 148 Page - Texas Instruments

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TPS650830
SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
www.ti.com
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Product Folder Links: TPS650830
Layout
Copyright © 2014–2016, Texas Instruments Incorporated
9.2.3
ZCG Package
Figure 9-6. Top Layer ZCG Layout
Figure 9-7. Bottom Layer ZCG Layout
9.3
Thermal Considerations
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically
requires special attention to power dissipation. Many system-dependent issues such as thermal coupling,
airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components
affect the power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
•
Improving the power dissipation capability of the PCB design
•
Improving the thermal coupling of the component to the PCB by soldering the PowerPAD™
•
Introducing airflow in the system
For more details on how to use the thermal parameters in the dissipation ratings table please check the
Thermal Characteristics Application Note (SZZA017) and the IC Package Thermal Metrics Application
Note (SPRA953).



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