DSP56364 datasheet(18/148 Pages) FREESCALE

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Thermal Characteristics

DSP56364 Technical Data, Rev. 4.1

3-2

Freescale Semiconductor

3.3

Thermal Characteristics

Table 3-1 Maximum Ratings

Rating1

1 GND = 0 V, V

CC = 3.3 V ± 0.16 V, TJ = –0°C to +105°C, CL = 50 pF

Symbol

Value1, 2

2 Absolute maximum ratings are stress ratings only, and functional operation at the maximum is not guaranteed. Stress beyond

the maximum rating may affect device reliability or cause permanent damage to the device.

Unit

Supply Voltage

VCC

−0.3 to +4.0

All input voltages excluding “5 V tolerant” inputs3

3 CAUTION: All “5 V Tolerant” input voltages must not be more than 3.95 V greater than the supply voltage; this restriction

applies to “power on”, as well as during normal operation. In any case, the input voltages cannot be more than 5.75 V. “5 V

Tolerant” inputs are inputs that tolerate 5 V.

VIN

GND -0.3 to VCC + 0.3

All “5 V tolerant” input voltages3

VIN5

GND

− 0.3 to V

CC + 3.95

Current drain per pin excluding VCC and GND

Operating temperature range

-40 to +105

°C

Storage temperature

TSTG

−55 to +125

°C

Table 3-2 Thermal Characteristics

Characteristic

Symbol

TQFP Value

Unit

Junction-to-ambient thermal resistance1

1 Junction-to-ambient thermal resistance is based on measurements on a horizontal single-sided printed circuit board per SEMI

G38-87 in natural convection. (SEMI is Semiconductor Equipment and Materials International, 805 East Middlefield Rd.,

Mountain View, CA 94043, (415) 964-5111.)

Measurements were done with parts mounted on thermal test boards conforming to specification EIA/JESD51-3.

RθJA or θJA

49.87

°C/W

Junction-to-case thermal resistance2

2 Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI G30-88, with the exception that

the cold plate temperature is used for the case temperature.

RθJC or θJC

9.26

°C/W

Thermal characterization parameter

2.0

°C/W

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